

Rogers Corp.has introduced RT/duroid® 6035HTC, a new high-thermal-conductivity (HTC) laminate material engineered for low loss in high power circuits. The fluoropolymer composite material is ideal for RF and microwave applications in military and high reliability (hi-rel) applications required to handle high power levels, such as power amplifiers.
The Rogers 6035HTC Laminate is helpful in commercial and military aviation, aerospace, communications, and WLAN equipment. It is used for signal transmission and as a powerful medium in telecommunications. The materials are also essential for radar jamming applications, RFID tags and tracking systems, microwave vacuum tubes, high-power pulse generators, and other high-power applications. However, the material is mainly helpful in high-frequency transmitting circuits because of its electrical properties.
RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.
Rogers 6035HTC Laminate is useful in the following applications, among others:
Infrared Image Sensor, Mobile Radars, Radar Jamming Systems, Military Aircrafts, Alcatel Cell Phones & Telecommunications Networks.
· Dielectric constant of 3.50 +/- .05
· Dissipation factor of .0013 at 10GHz
· Thermal conductivity of 1.44 W/m/K at 80°C
· Thermally stable low profile and reverse treat copper foil
· High thermal conductivity
· Improved dielectric heat dissipation, enabling lower operating temperatures for high power applications
· Excellent high frequency performance
· Lower insertion loss and excellent thermal stability of traces
| RO6035htc Parameter | Numerical value |
| Board materal | RO6035htc |
| Dielectric constant(εr ) | 3.6 |
| Dissipation Factor, tan εr | 0.0013 |
| Thermal Coeffi cient of εr | -66 |
| Dimensional Stability | -0.11 -0.08 |
| Volume Resistivity | 10^8 |
| Surface Resistivity | 10^8 |
| Tensile Modulus | 329 244 |
| Thermal Conductivity |
1.44 |
| Coeffi cient of Thermal Expansion |
19 19 39 |
| Density |
2.2 |
| Copper Peel Strength |
7.9 |
| Flammability | V-0 |
| Lead Free Process Compatible | yes |
| Service area |
Around the world |
Dickson Circuit Co.,Ltd has a 17 year history of producing high frequency PCB.
We cooperates with many well-known companies such as Samsung, Osram, Philips, and China Southern Power Grid.
The quality is guaranteed and the price is very affordable.
Just give me a Gerber file, and I will definitely give you a satisfactory product.
If you are interested, please feel free to contact me at any time.
Mikro
Email: Mikro@dicksoncircuit.com
Tel: +86 137 135 41332
WhatsApp:+86 137 135 41332